3D X-ray CT system - List of Manufacturers, Suppliers, Companies and Products

3D X-ray CT system Product List

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3D X-ray CT system "3DCT Series"

3D X-ray CT system "3DCT Series"

Capable of handling a wide range of work from high power to low power!

The "3DCT Series" is a three-dimensional X-ray CT system that utilizes our unique technology, the U-Centric (focus-centered rotation) function, allowing for 360-degree perspective observation and high-magnification CT imaging of the focused point with "microscopic vision" and even "nanoscopic vision." We offer a lineup that includes the ultra-high-resolution model "XVA-160αII," which achieves ultra-high magnification (2,000 times) and a nano-order focus size (250/800nm), as well as the standard model "XVA-160R" and the wide-range model "Si-230/300." These systems are widely adopted for the non-destructive analysis of compact, high-density, and multi-layered high-function electronic components with high precision. 【Features of "XVA-160αII 'Z'】 This ultra-high-resolution model achieves ultra-high magnification (2,000 times) and nano-order size (250/800nm). There are imaging examples such as transmission images and tomographic images of fingerprint sensors, as well as tomographic images of electromigration. It is equipped with numerous features, including the U-Centric function, optical axis, rotation center, and automatic focus adjustment functions. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Non-destructive testing

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[UHS_X-ray CT System Imaging Case] CT Cross-section of Solder Crack

[UHS_X-ray CT System Imaging Case] CT Cross-section of Solder Crack

This is a case where a micro-focus X-ray CT system XVA-160RZ was used to perform CT imaging of an interposer substrate, detecting solder cracks.

The XVA-160RZ is a versatile 3D X-ray CT system that can be used for quality assurance, failure analysis, and inspection of semiconductors, electronic components, and electronic modules. By utilizing functions such as real-time observation, 3D oblique CT, and orthogonal CT according to the application, it not only facilitates efficient analysis work but also dramatically improves the success rate of analyses. Additionally, by using the standard program operation function, it can also be employed for product sorting and sampling inspection purposes.

  • Non-destructive testing

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[UHS_X-ray CT System Imaging Example] QFP_Wire

[UHS_X-ray CT System Imaging Example] QFP_Wire

This is a case of performing orthogonal CT imaging of the wire bonding section inside a QFP using the Micro Focus X-ray CT system XVA-160RZ.

This is an example of a QFP (Quad Flat Package) captured using orthogonal CT. It is possible to closely observe even the indentations from the second bonding of the wires. The XVA-160RZ allows for easy orthogonal CT imaging simply by attaching a dedicated unit without the need to change the stage. Similar to oblique CT, orthogonal CT can also be performed at high magnification.

  • Non-destructive testing

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【UHS_X-ray CT System Imaging Case】QFP Observation Case

【UHS_X-ray CT System Imaging Case】QFP Observation Case

This is a case of CT imaging of a QFP using the Micro Focus X-ray CT system XVA-160RZ.

This is an example of a QFP (Quad Flat Package) captured using orthogonal CT. It allows for detailed observation of the internal chip patterns. The XVA-160RZ enables easy orthogonal CT imaging simply by attaching a dedicated unit without the need to change the stage. Similar to oblique CT, orthogonal CT can also be performed at high magnification.

  • Non-destructive testing

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[UHS_X-ray CT System Imaging Example] Electrolytic Capacitor

[UHS_X-ray CT System Imaging Example] Electrolytic Capacitor

This is a case of CT imaging of an electrolytic capacitor using the Micro Focus X-ray CT system XVA-160RZ.

This is a case of a conductive polymer aluminum solid electrolytic capacitor imaged using transmission imaging and oblique CT scanning. It allows for the confirmation of internal structures and observation of solder conditions. The XVA-160RZ is a standard model that can widely observe various defects in a diverse range of workpieces. Additionally, it is a device that can contribute to the efficiency of analysis, as it can perform CT scanning in just three and a half minutes.

  • Non-destructive testing

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3D X-ray CT system 'XVA-160RA/160αII "Z"'

3D X-ray CT system 'XVA-160RA/160αII "Z"'

Easily achieve high magnification observation with the unique technology "User-Centric Mechanism." New products are showcased at "Electro Test Japan."

Our company offers a 3D X-ray CT system that employs our unique technology, the "U-Centric Mechanism," enabling easy and efficient observation at high magnification. In diagonal CT imaging, bringing the target area closer to the X-ray focus allows for high-magnification tomographic imaging. This enables detailed observation and strongly supports the discovery and analysis of defects in printed circuit boards and semiconductor devices. 【Features】 ◎ 'XVA-160RA' ■ A newly revamped model based on the standard model, compatible with high-resolution generators ■ Equipped with a nano-focus X-ray generator (focus size 250/800nm) ■ Allows for clear observation of details at a magnification of 1,600 times ■ Includes visible light mapping function and automatic focus adjustment function ◎ 'XVA-160αII "Z"' ■ A high-end model specialized for even higher magnification, capable of analyzing the internal structure of packages ■ Equipped with a nano-focus X-ray generator (focus size 200nm and above) ■ Allows for precise observation of detailed structures at a magnification of 2,000 times ■ Includes a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus ★ Our company will exhibit at "Electrotest Japan," held at Tokyo Big Sight from January 22 (Wednesday).

  • Non-destructive testing

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